Hoʻomākaukau no ka Carboxylterminated no ka Fusion-bonded-epoxy Powder Coating

Hoʻomākaukau a me ke ʻano o ka Carboxylterminated Poly (butadiene-co-acrylonitrile) -epoxy Resin Prepolymers no Fusion-bonded-epoxy Ka Waihona Powder

1 Introduction

Epoxy-hoʻopaʻa ʻia (FBE) ka pauda i hoʻomohala mua ʻia e 3M Co., hoʻohana nui ʻia i ka wā he koʻikoʻi ka pale ʻana i ka corrosion no ka wā lōʻihi e like me ka ʻoihana ʻaila, metala, kinoea a me nā paipu wai. Eia nō naʻe, paʻakikī nā koi o ka hana no ka FBE powder coatings ma muli o ko lākou kiʻekiʻe cross-linking density. ʻO ka brittleness inherent o nā uhi i hoʻōla ʻia kekahi o nā keʻakeʻa nui e pale ana i ka noi ākea no nā epoxies i nā ʻoihana. No laila, hiki ke hoʻomaikaʻi i ka hana o nā uhi FBE ma o ka hoʻonui ʻana i ka paʻakikī o ka uhi. mea ʻeleʻele, copolymer, nanoparticle i ho'ololi 'ia epoxies a me ka hui 'ana o ka luna.
ʻOiai ua nui nā noiʻi i nā hoʻololi paʻakikī o nā ʻōnaehana epoxy, ʻo ka hapa nui o nā
ʻO nā haʻawina e pili ana i ka hoʻololi kemika o ka resin epoxy me ka ʻōpala wai reactive, ʻoi aku ka carboxyl-terminated butadiene-co-acrylonitrile (CTBN). Ua hoʻohana ʻo McGarry et al i ka CTBN o ke kaumaha molekala 3000 a me nā epoxies DGEBA like ʻole i hoʻōla ʻia me ka piperidine. Ua hōʻike ʻo Kinloch et al i kahi hilinaʻi ikaika i ka ʻōnaehana DGEBA/CTBN/piperidine ma o ka helu ʻana i ka paʻakikī o ka haʻihaʻi hopena i nā wikiwiki hahau like ʻole a loaʻa ka piʻi kokoke ʻelua o ka paʻakikī. Hiki ke hoʻokomo ʻia ʻo CTBN i nā ʻōnaehana epoxy e like me ka diglycidyl ether o nā resins epoxy bisphenol-A (DGEBA). Ke hoʻōla ʻia kēlā mau epoxy resins me ka ʻōpala wai, hiki ke hoʻomaikaʻi ʻia ka paʻakikī o nā kāʻei ma o ka lawe ʻana i ka ikehu hopena. Ua ʻike ʻia ʻo ka resins cured e loaʻa i nā ʻōnaehana ʻelua [26] kahi i hoʻopuehu ʻia ai ka wai wai i loko o kahi matrix o ka epoxy me kahi hoʻolālā spherical domain a i ʻole kahi hoʻomau mau.
A hiki i kēia manawa, ʻo ka hoʻoikaika ʻana i nā resins epoxy i kālele nui ʻia i nā resins epoxy wai, a ua nānā ka noiʻi liʻiliʻi i ka hoʻoikaika ʻana i nā resins epoxy paʻa. A laila ua hana ʻia nā mea hoʻohuihui pauka FBE i hoʻopiha ʻia me CTBN-EP prepolymers. Ma muli o nā ʻano mekini a me ka nānā ʻana i ka morphological, ua hoʻāʻo ʻia e kālailai i nā mīkini paʻakikī e kū nei i ka matrix i hoʻokaʻawale ʻia. ʻO ka nānā ʻana i ka pilina waiwai o ka ʻōnaehana CTBN-EP he hana hou i ka maikaʻi o kā mākou ʻike. No laila, hiki i kēia ʻenehana hoʻoikaika paʻakikī ke hoʻonui i nā wahi noi o nā uhi pauka FBE i ka ʻoihana.

2 Hoʻokolohua

Nā Pono 2.1

ʻO ka epoxy resin i hoʻohana ʻia ʻo ia ka diglycidyl ether paʻa o bisphenol A (DGEBA) (DOW, DER663) me ke kaumaha like epoxide o 750-900. ʻO ka wai, ka poli i hoʻopau ʻia ka carboxyl (butadiene-co-acrylonitrile) (CTBN) (Emerald, Hypro 1 300×1323) me kahi acrylonitrile maʻiʻo o 26% i hoʻohana ʻia. Ua hoʻohana ʻia ʻo Triphenyl phosphine ma ke ʻano he catalyst i kēia ʻōnaehana. ʻO ka lāʻau lapaʻau (HTP-305) he phenolic. Ua kūʻai ʻia ʻo Phenolic epoxy resin (GT7255) mai HUNTSMAN Co., Pigment (L6900), i hoʻolako ʻia e BASF Co., ua kūʻai ʻia ka mea hoʻoheheʻe Degassing a me ka mea hoʻonaninani mai Aisitelun.

2.2 Synthesis a me ke ano o CTBNEP prepolymers

Hoʻokomo ʻia ka nui Stoichiometric o nā resins epoxy, CTBN a me ka catalyst i loko o kahi ipu e like me ka wela a hoʻoulu ʻia me ka hoʻoulu ʻana ma 150 ℃ no 3.0 hola. Ua kāpae ʻia ka hopena i ka wā i hāʻule ai ka waiwai waika i 0. Ua hōʻailona ʻia nā prepolymers ʻo C0, C5, C10, C15, a me C20 (ʻo nā subscripts nā mea o ka CTBN). Hōʻike ʻia ka hopena hiki ke hōʻike ʻia ma Fig.1.
Ua hoʻohana ʻia ka spectroscopy FTIR e ʻike i nā hale. Ua hoʻopaʻa ʻia ka spectra FTIR e kahi spectrophotometer FTLA2000-104 ma ka laulā hawewe o 4 500–500 cm−1 (ABB Bomem o Kanada). Ua hoʻoholo ʻia nā paona molekala a me ka hāʻawi ʻana i ke kaumaha molekala o CTBN-EP prepolymers e GPC. Hoʻohana ʻia ʻo Tetrahydrofuran (THF) ma ke ʻano he eluent ma kahi kahe kahe o 1.0 mL/min. Hoʻopili ʻia ka ʻōnaehana kolamu me ka hoʻohana ʻana i nā polystyrenes maʻamau monodispersed.

2.3 Ka hoʻomākaukau ʻana a me ke ʻano o ka mālama ʻana i nā kiʻiʻoniʻoni

ʻElima mau kiʻi hoʻōla i loaʻa ka 0wt%-20wt% CTBN i hoʻomākaukau ʻia. ʻO nā helu helu DGEBA (e like me ke ʻano i hāʻawi ʻia ma ka Papa 1) a me HTP-305 i hoʻoulu ʻia ma 120 ℃ no 10 min e loaʻa ai kahi hui like. Ua ninini ʻia ka hui ʻana i loko o kahi pahu hao preheated i hoʻōla ʻia i loko o ka umu wela ma 180 ℃ no 10 min a laila hoʻopaʻa ʻia no 30 min ma 200 ℃.

Ua hana ʻia nā hoʻāʻo tensile ma kahi mīkini KD111-5 (KaiQiang Co., Ltd., Kina) ma ka wikiwiki o ke poʻo o 1 mm / min. Lawe ʻia nā waiwai mai ka awelika o ʻekolu mau laʻana e like me GB/2568-81. Ua loiloi ʻia ka elongation ma ka haki ʻana o ka specimen. Ua hoʻoholo ʻia ka ikaika o ka hopena o ka specimen ma kahi mīkini MZ-2056 me ka hoʻohana ʻana i nā specimens rectangular o 40 mm × 10 mm × 2 mm. Ua lawe ʻia nā hoʻāʻo ma ka lumi wela a ua lawe ʻia nā waiwai mai ka awelika o ʻekolu mau laʻana e like me GB / T2571-1995.

Hoʻoholo ʻia nā mahana hoʻololi aniani o nā kiʻi ʻoniʻoni me ka hoʻohana ʻana i ka mīkini dynamic analyzer (DMA) . Ua hana ʻia nā ana ma ka wikiwiki hoʻomehana o 2 ℃ / min mai -90 ℃ a i 180 ℃ ma kahi pae alapine paʻa o 1 Hz. Ua loaʻa ka modulus mālama, modulus poho a me ka helu poho me ka hoʻohana ʻana i ke ʻano cantilever ʻelua me kahi laʻana o ka nui 30 mm × 10 mm × 2 mm.

Ua hana ʻia ka nānā ʻana i ka microscopy electron (SEM) (Quanta-2000 model SEM, FEI o Dutch) me ka uila uila o 10 kV. Ua haki ʻia nā laʻana ma lalo o ka wai hau hau a mālama mua ʻia me ka toluene e unuhi i ka lāʻau lapaʻau ma mua o ka maloʻo ʻana ma lalo o ka momi. Ua hoʻoholo ʻia ka nui a me ka hāʻawi ʻana o nā ʻāpana i hoʻopuehu ʻia ma o ke kiʻi ʻana i ke kiʻi semiautomatic.

Ua loiloi ʻia ka pākēneka o ka pohō kaumaha a me nā ʻano hoʻohaʻahaʻa wela o nā laʻana i hoʻomākaukau ʻia e kahi thermogravimetric analyzer (TGA) i hoʻopaʻa ʻia ma ka Instrument (METTER Toledo o Switzerland). ʻO ka nui o ka laʻana i lawe ʻia ma kahi o 5-10 mg i loko o kahi pā palaina platinum. Ua mālama ʻia ka helu hoʻomehana i kēlā me kēia holo ma 10 ℃/min a ʻo ka pae wela ka ambient i 800 ℃.